Embedded Storage

eMMC

• Compatible, stable, and widely used in smartphones, tablets, smart TVs, STBs, and other fields
• The product is developed based on the new-generation LDPC controller and 3D NAND Flash.
• They can be used in complex and fluctuating application scenarios, which makes them perfect for meeting customers' demanding requirements in regards to eMMC performance and stability.

Automotive/Industrial Wide-temperature/Industrial eMMC

• Work around the clock for extended periods in harsh environments
• The high reliability and long service life ensure working around the clock for extended periods.
• The mean time between failures (MTBF) exceeds 20 million hours.
• The product not only has good read/write performance and reliability but also helps reduce the CPU platform development difficulties.

Subsize eMMC

• Innovative eMMC with a smaller size and lower power consumption
• The product is compact and requires less PCB space. The product complies with JEDEC pin standards.

UFS

• Large capacity, high performance, and applicable to middle-range and high-end smartphones
• The product has low power consumption, ensuring long battery life of users' smartphones. It supports UFS2.2 new features, such as write booster and HBP.
• It allows mobile devices to rival PCs in terms of the storage performance.

LPDDR

• Low-power memory product that is widely used for portable devices
• The product features high performance and low power consumption.
• The latest LPDDR4x product has a capacity of up to 64Gb with 50% performance improvement over LPDDR3.
• LPDDR5 data rate up to 6400Mbps, higher performance LPDDR5X is also under development (up to 8533Mbps rate), to meet the higher memory requirements of the terminal applications.

ePOP

• Small size, low power consumption, and born for smart wearable devices
• The product is highly integrated and compact, saving PCB space.
• The low-power design helps wearable devices extend their standby time.
• The product provides various capacity combinations, such as 8GB+4Gb and 8GB+8Gb.

Automotive UFS

• High reliability and long service life ensure the equipment to work all weather for a long time
• Compatible with mainstream platforms: Supports LDPC algorithm, Write Booster, HPB, emergency power outage protection, FFU upgrade, FBA data acceleration, and other functions

Parallel NAND Flash

• Comprehensive test, including 80 sub-items in 50 major items, and actual defect parts per million (DPPM) of less than 100
• The product has undergone a comprehensive test including 80 sub-items in 50 major items, and the actual DPPM is less than 100.
• As one of our main products, it features a 1xnm process, build-in 4-bit ECC verification, and high density, thus suitable for big data storage.
• It also supports OTP, allowing more room for customers to securely store information.

SPI NAND Flash

• WSON8 packaging, saving PCB space
• The product utilizes WSON8 packaging to save PCB space.
• The product is equipped with a general-purpose SPI and internal error correcting code (ECC) to improve data transmission efficiency and ensure data reliability.
• It also supports OTP, allowing more room for customers to securely store information.

DDR3L

• 40+ production tests, meeting various data caching demands
• The product has undergone 40+ production tests, including the aging test, high/low temperature tests, and pressure test, ensuring reliable quality.
• The product features a 2xnm process and rate of up to 2133Mbps.
• The product meets the data caching demands of network communication, consumer electronics, and smart devices.

NAND-Based MCP

• Stacked packaging of Flash and LPDDR, saving PCB space
• Stacked packaging of Flash and LPDDR simplifies cabling design and saves PCB space.
• A core voltage of 1.8V meets the low power consumption requirement of wearable devices and the Internet of Things (IoT).
• The product integrates DDR and NAND, which helps customers reduce the number of components to be purchased in the BOM, simplify purchase, and reduce costs.