Bluetooth Chips
WQ7033
High-end Bluetooth audio SoC
WQ7033 is a high-standard Bluetooth audio SoC chip that supports BT/BLE 5.3 dual protocol stack and BLE Audio. Embedded with the HiFi 5 DSP and NPU, as well as integrated with Hybrid ANC, the chip supports complex multi-microphone uplink noise reduction algorithms and key word spotting in low power. WQ7033 features various interfaces and high-level integration. It is applicable to advanced TWS noise reduction earphones that require noise reduction in large bandwidth and depth and other low-power products that require sophisticated audio processing and voice AI capabilities.
Features
- Supports BT /BLE 5.3 dual protocol stack.
- Integrates two high-performance RISC-V CPUs, HiFi 5 DSP and NPU.
- Adopts hybrid (FF+FB) ANC.
- Supports multi-Mic+AI call noise reduction, significantly improving call experience.
- Supports ultra-low power consumption with 3.x mA in average for a longer battery life of headsets.
- Supports the W-TWS+ solution, realizing senseless and intelligent primary-secondary switchover.
- Supports the multi-link mechanism, with one pair of earbuds connecting to two devices.
WQ7036
Premium Bluetooth audio SoC
WQ7036 is a high-standard Bluetooth audio SoC chip that is embedded with the HiFi 5 DSP and NPU to support complex multi-microphone uplink noise reduction algorithms and key word spotting in low power. WQ7036 integrates a hybrid (FF+FB) ANC, which supports headset applications that support depth noise reduction in high bandwidth. WQ7036 features various interfaces and high-level integration. It is applicable to advanced TWS noise reduction earphones and other low-power products that require sophisticated audio processing and voice AI capabilities.
Features
- Supports BT /BLE 5.3 dual protocol stack.
- Support BLE Audio and LC3 codec.
- Supports hybrid (FF+FB) ANC.
- Provides larger SRAM and Flash memories to realize wide applications.
- Improves RF performance.
- Supports various products.
